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한국어
  • MEC3F0S<br><font ='#888888' size='2%'>3D TLC</font>
MEC3F0S
3D TLC

Specifications

  • 용량
  • 1TB, 2TB, 4TB
  • Interface
  • PCIe Gen3x4, NVMe
  • Flash Technology
  • 3D TLC
  • External DRAM Buffer
  • ●
  • Seq. Performance Read (max.)
  • 3,400 MB/s
  • Seq. Performance Write (max.)
  • 3,000 MB/s
  • Random 4K Write (IOPS max.)
  • 650000
  • Random 4K Read (IOPS max.)
  • 670000
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Power Consumption (idle)
  • 670 mA
  • Operating Temp. (Standard)
  • -20°C ～ 75°C
  • Storage Temperature
  • -55°C ～ 95°C
  • Accessories
  • 10% ～ 95% (30°C Max. Wet Bulb Temp)
  • Vibration
  • 20G, 80~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Power Shield
  • ●
  • Power Consumption(max.)
  • 2450 mA
  • End-to-End Data Protection
  • ●
  • TRIM
  • ●
  • DEVSLP
  • ●
  • SP SMART Utility
  • ●
  • 보증
  • 3 years and within guaranteed TBW

Features

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.3
  • Support Data Security with AES 256 Encryption (Optional)
  • Support SP Toolbox SMART health monitoring software

Order Information

MEC3F0S
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2280 3D TLC PCIe3.0 1TB -20°C ～ 75°C SP010TIMEC3F5SV0
M.2 2280 3D TLC PCIe3.0 2TB -20°C ～ 75°C SP020TIMEC3F5SV0
M.2 2280 3D TLC PCIe3.0 4TB -20°C ～ 75°C SP040TIMEC3F5SV0
M.2 2280 3D TLC PCIe3.0 8TB -20°C ～ 75°C SP080TIMEC3F5SV0
Show P/N by Capacity:
1TB
Form Factor M.2 2280
NAND 3D TLC
Interface PCIe3.0
Capacity 1TB
Temp. -20°C ～ 75°C
P/N SP010TIMEC3F5SV0

다운로드

Factsheet
Name Language File Format Version Date 다운로드
MEC3F0S EN pdf. v1.0 2021/08
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