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  • MEA3F0E<br><font ='#888888' size='2%'>3D TLC</font>
MEA3F0E
3D TLC

Spécifications

  • Capacité
  • 256GB, 512GB, 1TB, 2TB
  • Interface
  • PCIe Gen3x4, NVMe
  • Flash Technology
  • 3D TLC
  • Seq. Performance Read (max.)
  • 2,400 MB/s (estimated)
  • Seq. Performance Write (max.)
  • 2,100 MB/s (estimated)
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Random 4K Read (IOPS max.)
  • 506,000 (estimated)
  • Random 4K Write (IOPS max.)
  • 680,000 (estimated)
  • Power Consumption (idle)
  • 3420 mA (TBD)
  • Dimension（mm）
  • 42.0 x 22.0 x 3.6
  • Operating Temp. (Standard)
  • -20°C ~ 75°C
  • Température de stockage
  • -55℃ ～ 95℃
  • Température de fonctionnement
  • -20°C ~ 75°C
  • Vibration
  • 20G, 80~2000Hz
  • Laissez tomber
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Shield
  • ●
  • Power Requirement
  • DC 3.3V
  • Consommation d\'énergie(max.)
  • 3500 mA (TBD)
  • TRIM
  • ●
  • End-to-End Data Protection
  • ●
  • S.M.A.R.T.
  • ●
  • SP SMART Utility
  • ●
  • Garantie
  • 3 years and within TBW

Caractéristiques

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.3
  • Support Data Security with AES 256 Encryption (Optional)
  • Support SP Toolbox SMART health monitoring software

Informations de la commande

MEA3F0E
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2242 3D TLC PCIe3.0 256GB -20°C ～ 75°C SP256GIMEA3F5EV0
M.2 2242 3D TLC PCIe3.0 512GB -20°C ～ 75°C SP512GIMEA3F5EV0
M.2 2242 3D TLC PCIe3.0 1TB -20°C ～ 75°C SP010TIMEA3F5EV0
M.2 2242 3D TLC PCIe3.0 2TB -20°C ～ 75°C SP020TIMEA3F5EV0
Show P/N by Capacity:
256GB
Form Factor M.2 2242
NAND 3D TLC
Interface PCIe3.0
Capacity 256GB
Temp. -20°C ～ 75°C
P/N SP256GIMEA3F5EV0

Télécharger

Factsheet
Nom La langue File Format Version Données Télécharger
MEA3F0E EN pdf. v4.0 2022/09
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