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Deutsch

Technische Daten

  • Kapazität
  • 480GB / 960GB / 1920GB / 3840GB
  • Schnittstelle
  • PCIe Gen4x4
    NVMe1.4
  • Flash Technology
  • 3D TLC
  • Seq. Performance Read (max.)
  • 6800 MB/s
  • Seq. Performance Write (max.)
  • 2000 MB/s
  • MTBF (est)
  • > 2,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Dimension（mm）
  • 118.75 x 33.75 x 9.5
  • Operating Temp. (Standard)
  • 0°C ~ 70°C
  • Speichertemperatur
  • -40°C ～ 85°C
  • Vibration
  • 20G, 80Hz~2000Hz
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 12V
  • Stromverbrauch(max.)
  • 13.5 W
  • Bending
  • 10N
  • Duration (cycles)
  • 3000
  • S.M.A.R.T.
  • ●
  • SP SMART Utility
  • ●
  • Gewährleistung
  • 3 years and within guaranteed TBW

Merkmale

  • EDSFF E1.S form factor
  • PCIe Gen4x4, NVMe 1.4
  • Read/Write speed up to : 6800/2000 (MB/s)
  • Enhanced Data reliability with LDPC ECC Protection
  • End-to-End Data Path Protection – TCG OPAL 2.0 – Sanitize – SECDED
  • UBER: <1 sector per 1017 bits read
  • PE cycle: 3,000

Bestellinformation

ESD3H0S

Form Factor NAND Interface Capacity Temp. P/N
EDSFF E1.S 3D TLC PCIe Gen4x4 480GB 0°C ~ 70°C SP480GIESD3H1SV0
EDSFF E1.S 3D TLC PCIe Gen4x4 960GB 0°C ~ 70°C SP960GIESD3H1SV0
EDSFF E1.S 3D TLC PCIe Gen4x4 1920GB 0°C ~ 70°C SP019TIESD3H1SV0
EDSFF E1.S 3D TLC PCIe Gen4x4 3840GB 0°C ~ 70°C SP038TIESD3H1SV0
Show P/N by Capacity:
480GB
Form Factor EDSFF E1.S
NAND 3D TLC
Interface PCIe Gen4x4
Capacity 480GB
Temp. 0°C ~ 70°C
P/N SP480GIESD3H1SV0

Herunterladen

Factsheet
Name Sprache File Format Version Datum Herunterladen
ESD3H0S EN pdf. v1.0 2024/07
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