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  • MEM3M0E<br><font color='#888888' size='2%'> 3D TLC</font>
MEM3M0E
3D TLC

Specifications

  • Capacity
  • 256GB, 512GB, 1TB
  • Dimensions
  • 30.0 x 22.0 x 3.5 mm
  • Interface
  • PCIe Gen4x4, NVMe
  • Flash Technology
  • 3D TLC
  • Seq. Performance Read (max.)
  • 4,500 MB/s
  • Seq. Performance Write (max.)
  • 2,400 MB/s
  • Random 4K Read (IOPS max.)
  • 865,000
  • Random 4K Write (IOPS max.)
  • 624,000
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • PE cycle
  • 3000
  • Power Consumption (idle)
  • 303 mA
  • Operating Temp. (Standard)
  • -20°C～75°C
  • Storage Temperature
  • -55°C～95°C
  • Operating Humidity
  • 10% to 95% RH, non-condensing
  • Vibration
  • 20G, 10~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Power Consumption(max.)
  • 1300mA
  • Advanced Power Shield
  • ●
  • DEVSLP/ TRIM
  • ●
  • TCG Opal 2.0
  • ●
  • AES 256
  • ●
  • Thermal Throttling
  • ●
  • S.M.A.R.T.
  • ●
  • Write Protection
  • ●
  • Quick Erase
  • ●
  • SP SMART Utility
  • ●
  • Warranty
  • 3 years and within TBW

Features

  • Compliant with PCI Express Base Specification Revision 4 standard with Gen4x4 8GB/s bandwidth.
  • Supports Data Security AES Encryption
  • Support TCG-OPAL 2.0
  • Optional hardware Write Protect Switch (Optional).

Order Information

MEM3M0E
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2230 3D TLC PCIe4.0 256GB -20°C～75°C SP256GIMEM3M5EV0
M.2 2230 3D TLC PCIe4.0 512GB -20°C～75°C SP512GIMEM3M5EV0
M.2 2230 3D TLC PCIe4.0 1TB -20°C～75°C SP010TIMEM3M5EV0
Show P/N by Capacity:
256GB
Form Factor M.2 2230
NAND 3D TLC
Interface PCIe4.0
Capacity 256GB
Temp. -20°C～75°C
P/N SP256GIMEM3M5EV0

Download

Factsheet
Name Language File Format Version Date Download
MEM3M0E EN pdf. v1.0 2024/06
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