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Cloud Computing & Networking

As the technology advances, the requirements for higher densities and performance continue to escalate, while reliability is mandatory. Signal integrity is the most essential and critical piece of the network. To achieve this, the system needs to be both resilient and durable, as transmission links are often located in remote places and are susceptible to harsh environmental conditions. As many installations are faced with space constraints there is a high demand for smaller and space-saving solutions. Customers are demanding faster streaming and better quality, pushing the envelope for modern networks to handle larger and larger amounts of data. So in addition to reliability and compactness, data transfer speed is.

An important component of cloud computing & networking and infrastructure is memory, which determines how much data can be stored on a device and how fast it could be transmitted, processed and accessed.
Solution
Silicon Power offers a broad line of form factors in industrial temp pSLC, MLC, TLC flash, with a range of densities and features, as well as cost effective solutions, all with a controlled BOM to ensure consistent performance and host compatibility once qualified.

We deliver industrial-grade modules with specs that meet the high demands of signal strength for the cloud computing & networking market. Both our DRAM & flash modules boasts high capacity and fast speeds to ensure sustained networking performance. With our broad range of compact form factors and flash types, we can ensure a stable and long term solution that meets your requirements.

Please visit our complete solution guide to find what best suits your Cloud Computing & Networking needs, talk to our team to tailor your fit!
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NEWS

2022-08-18

SP Industrial’s BiCS5 Flash Cards for Surveillance Edge and Professional Cinema Storage

BiCS5 is the latest version of 3D TLC NAND technology, featuring 112 layers in a single NAND Flash chip. The higher storage density is achieved by more layers of memory cells vertically stacked and more cells horizontally placed on a chip....

Read more
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