Go Top

請選擇語言

Asia/Pacific
  • AustraliaAustralia
    English
  • BangladeshBangladesh
    English
  • CambodiaCambodia
    English
  • ChinaChina
    中文 (简体)
  • HongKongHongKong
    中文 (繁體)
  • IndiaIndia
    English
  • IndonesiaIndonesia
    English
  • JapanJapan
    日本語
  • KoreaKorea
    한국어
  • MalaysiaMalaysia
    English
  • MongoliaMongolia
    English
  • MyanmarMyanmar
    မြန်မာ
  • NepalNepal
    English
  • New ZealandNew Zealand
    English
  • PakistanPakistan
    English
  • PhilippinesPhilippines
    English
  • SingaporeSingapore
    English
  • SriLankaSriLanka
    English
  • TaiwanTaiwan
    中文 (繁體)
  • ThailandThailand
    English
  • VietnamVietnam
    Tiếng Việt
Europe
  • AustriaAustria
    Deutsch
  • BelarusBelarus
    Pусский
  • BelgiumBelgium
    Dutch
  • BosniaBosnia
    English
  • BulgariaBulgaria
    English
  • CroatiaCroatia
    English
  • CyprusCyprus
    English
  • Czech RepublicCzech Republic
    English
  • DenmarkDenmark
    English
  • EstoniaEstonia
    English
  • FinlandFinland
    English
  • FranceFrance
    Français
  • GermanyGermany
    Deutsch
  • GreeceGreece
    English
  • HungaryHungary
    English
  • IcelandIceland
    English
  • IrelandIreland
    English
  • ItalyItaly
    Italiano
  • KazakhstanKazakhstan
    Pусский
  • KosovoKosovo
    English
  • LatviaLatvia
    English
  • LithuaniaLithuania
    English
  • MacedoniaMacedonia
    English
  • MaltaMalta
    English
  • NetherlandsNetherlands
    Dutch
  • NorwayNorway
    English
  • PolandPoland
    Polski
  • PortugalPortugal
    English
  • RomaniaRomania
    English
  • SerbiaSerbia
    English
  • SlovakiaSlovakia
    English
  • SloveniaSlovenia
    English
  • SpainSpain
    Español
  • SwedenSweden
    English
  • SwitzerlandSwitzerland
    Deutsch
  • TurkeyTurkey
    Türkçe
  • UkraineUkraine
    English
  • United KingdomUnited Kingdom
    English
North America
  • CanadaCanada
    English
  • United StatesUnited States
    English
Latin America
  • ArgentinaArgentina
    Español
  • BoliviaBolivia
    Español
  • BrasilBrasil
    English
  • ChileChile
    Español
  • ColombiaColombia
    Español
  • Costa RicaCosta Rica
    Español
  • Dominican RepublicDominican Republic
    Español
  • EcuadorEcuador
    Español
  • El SalvadorEl Salvador
    Español
  • GuatemalaGuatemala
    Español
  • HondurasHonduras
    Español
  • MéxicoMéxico
    Español
  • PanamaPanama
    Español
  • ParaguayParaguay
    Español
  • PeruPeru
    Español
  • UruguayUruguay
    Español
  • VenezuelaVenezuela
    Español
Middle East/Africa
  • AlgeriaAlgeria
    English
  • EgyptEgypt
    English
  • IsraelIsrael
    English
  • KenyaKenya
    English
  • LebanonLebanon
    English
  • LibyaLibya
    English
  • MauritiusMauritius
    English
  • MoroccoMorocco
    Français
  • Saudi ArabiaSaudi Arabia
    English
  • South AfricaSouth Africa
    English
  • TunisiaTunisia
    English
  • UAEUAE
    English
  • YemenYemen
    English
Others
  • OthersOthers
    English
  • MEC3H0E<br><font ='#888888' size='2%'>3D TLC</font>
MEC3H0E
3D TLC

規格

  • 容量
  • 256GB, 512GB, 1TB, 2TB
  • 傳輸介面
  • PCIe Gen4x4, NVMe
  • Flash Technology
  • 3D TLC
  • 循序讀取速度(最高)
  • 2,600 MB/s (estimated)
  • 循序寫入速度(最高)
  • 2,000 MB/s (estimated)
  • 4K隨機寫入速度 (IOPS)(最高)
  • 200,000 (estimated)
  • 4K隨機讀取速度 (IOPS)(最高)
  • 200,000 (estimated)
  • 平均故障間隔 (MTBF)(預估)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Power Consumption (idle)
  • 1155 mA (TBD)
  • 尺寸(公厘)
  • 80.0 x 22.0 x 3.6
  • 工作溫度(標準)
  • -20°C ~ 75°C
  • 儲存溫度
  • -55℃ ~ 95℃
  • 振動試驗
  • 15G, 10~2000Hz
  • 落摔試驗
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • 工作電壓
  • DC 3.3V
  • 電源防護
  • 耗電流(最高)
  • 1185 mA (TBD)
  • 端到端數據保護
  • TRIM
  • S.M.A.R.T.
  • SP智慧工具
  • 保固
  • 3 years and within TBW

特色

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.4
  • Support Data Security with AES 256 Encryption (Optional)
  • Support SP Toolbox SMART health monitoring software

訂購資訊

MEC3H0E
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2280 3D TLC PCIe4.0 256GB -20°C ~ 75°C SP256GIMEC3H5EV0
M.2 2280 3D TLC PCIe4.0 512GB -20°C ~ 75°C SP512GIMEC3H5EV0
M.2 2280 3D TLC PCIe4.0 2TB -20°C ~ 75°C SP010TIMEC3H5EV0
Show P/N by Capacity:
256GB
Form Factor M.2 2280
NAND 3D TLC
Interface PCIe4.0
Capacity 256GB
Temp. -20°C ~ 75°C
P/N SP256GIMEC3H5EV0

檔案下載

Factsheet
名稱 語言 檔案格式 版本 更新日期 檔案下載
MEC3H0E EN pdf. v4.0 2022/03