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English
  • MEC3M5RW<br><font ='#888888' size='2%'> 3D TLC</font>
MEC3M5RW
3D TLC

Specifications

  • Capacity
  • 256GB, 512GB, 1TB, 2TB
  • Interface
  • PCIe Gen4x4
  • Flash Technology
  • 3D TLC
  • Seq. Performance Read (max.)
  • 4645 MB/s
  • Seq. Performance Write (max.)
  • 4323 MB/s
  • Random 4K Write (IOPS max.)
  • 644K
  • Random 4K Read (IOPS max.)
  • 845K
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Power Consumption (idle)
  • 0.22 A
  • Dimension（mm）
  • 80.0 x 22.0 x 3.5
  • Operating Temp. (Wide)
  • -40°C ~ 85°C
  • Storage Temperature
  • -55°C ~ 95°C
  • Vibration
  • 15G, 10~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Power Shield
  • ●
  • PFP
  • ●
  • Power Consumption(max.)
  • 1.65 A
  • TRIM
  • ●
  • S.M.A.R.T.
  • ●
  • Warranty
  • 3 years within TBW

Features

  • Wide Temperature available
  • Enhanced Data reliability with LDPC ECC Protection
  • Built-in-Voltage detector for power shielding protection
  • SP SMART Toolbox
  • Features: PFP – AES256 – TCG OPAL 2.0 – Write Protect – Quick Erase

Order Information

MEC3M5RW
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2280 3D TLC PCIe Gen4x4 256GB -40°C ~ 85°C SP256GIMEC3M5RW0
M.2 2280 3D TLC PCIe Gen4x4 512GB -40°C ~ 85°C SP512GIMEC3M5RW0
M.2 2280 3D TLC PCIe Gen4x4 1TB -40°C ~ 85°C SP010TIMEC3M5RW0
M.2 2280 3D TLC PCIe Gen4x4 2TB -40°C ~ 85°C SP020TIMEC3M5RW0
Show P/N by Capacity:
256GB
Form Factor M.2 2280
NAND 3D TLC
Interface PCIe Gen4x4
Capacity 256GB
Temp. -40°C ~ 85°C
P/N SP256GIMEC3M5RW0

Download

Factsheet
Name Language File Format Version Date Download
MEC3M5RW EN pdf. v1.0 2024/08
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