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Compliant with SD Memory Card Specification 3.0 and backwards-compatible with 2.0, 1.1, and 1.01

English
  • SDT3L0<br><font ='#888888' size='2%'> 3D TLC</font>
SDT3L0
3D TLC

Specifications

  • Flash Technology
  • 3D TLC
  • Capacity
  • 32GB
  • Interface
  • SD 3.0 / UHS-I
  • Storage Temperature
  • -40°C ～ 85°C
  • Seq. Performance Read (max.)
  • 97 MB/s
  • Seq. Performance Write (max.)
  • 83 MB/s
  • Power Requirement
  • DC 3.3V
  • Power Consumption(max.)
  • 100 mA
  • Power Consumption (idle)
  • 300 uA
  • Dimension（mm）
  • 15.0 x 11.0 x 1.0
  • MTBF (est)
  • > 3,000,000 hrs *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Operating Temp. (Standard)
  • 0 ～ 70℃
  • Vibration
  • 15G, 10 ～ 2000Hz
  • Drop
  • 150cm
  • Shock
  • 1,500G@0.5ms
  • Torque
  • 0.15Nm
  • Bending
  • 10N
  • Duration (cycles)
  • 10000
  • Warranty
  • 3 years and within TBW

Features

  • Compliant with SD Memory Card Specification 3.0 and backwards-compatible with 2.0, 1.1, and 1.01
  • High endurance suitable for 24/7 continuous video recording
  • Steady performance design to ensure all frames are recorded

Order Information

SDT3L0
3D TLC

Form Factor NAND Capacity Temp. P/N
micoSD 3D TLC 32GB -25°C ～ 85°C SP032GISDT3L8NE0
Show P/N by Capacity:
32GB
Form Factor micoSD
NAND 3D TLC
Capacity 32GB
Temp. -25°C ～ 85°C
P/N SP032GISDT3L8NE0
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