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  • SSU3F0S<br><font color='#888888' size='2%'> 3D TLC</font>
SSU3F0S
3D TLC

仕様

  • 容量
  • 3.8TB, 7.6TB
  • 寸法
  • 100.0 x 69.85.0 x 7 mm
  • インターフェイス
  • PCIe Gen3x4, NVMe
  • Flash Technology
  • 3D TLC
  • External DRAM Buffer
  • シーケンスパフォーマンス読み取り (最大)
  • 3,300 MB/s (estimated)
  • シーケンスパフォーマンス書き込み (最大)
  • 900 MB/s (estimated)
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • ランダム4K読み取り
  • 600,000 (estimated)
  • ランダム4K書き込み
  • 200,000 (estimated)
  • Operating Temp. (Wide)
  • -40°C~85°C
  • 保管温度
  • -55°C ~ 95°C
  • 振動
  • 15G, 10~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Shield
  • 所要電力
  • DC 12V
  • TRIM
  • End-to-End Data Protection
  • DEVSLP
  • S.M.A.R.T.
  • SP SMART Utility
  • 保証期間
  • 3 years and within TBW

特長

  • NGFF U.2 (SFF-8639) standard form factor
  • Compliant with NVMe Express 1.3
  • Supports Data Security with AES 256 Encryption
  • Supports SP Toolbox S.M.A.R.T. health monitoring software

オーダー情報

SSU3F0S
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
U.2 3D TLC PCIe 3.1 3840GB -40°C~85°C SP038TISSU3F1SW0
U.2 3D TLC PCIe 3.1 7680GB -40°C~85°C SP076TISSU3F1SW0
Show P/N by Capacity:
3840GB
Form Factor U.2
NAND 3D TLC
Interface PCIe 3.1
Capacity 3840GB
Temp. -40°C~85°C
P/N SP038TISSU3F1SW0

ダウンロード

Factsheet
名前 言語 File Format バージョン 更新日 ダウンロード
SSU3F0S EN pdf. v2.0 2024/07