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English
  • MEC3H0S<br><font ='#888888' size='2%'>3D TLC</font>
MEC3H0S
3D TLC

Specifications

  • Capacity
  • 480GB, 960GB, 1.9TB, 3.8TB
  • Interface
  • PCIe Gen4x4, NVMe
  • Flash Technology
  • 3D TLC
  • External DRAM Buffer
  • ●
  • Seq. Performance Read (max.)
  • 7,200 MB/s (estimated)
  • Seq. Performance Write (max.)
  • 6,800 MB/s (estimated)
  • Random 4K Write (IOPS max.)
  • 1,000,000 (estimated)
  • Random 4K Read (IOPS max.)
  • 1,000,000 (estimated)
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Dimension（mm）
  • 80.0 x 22.0 x 3.6
  • Operating Temp. (Standard)
  • -20°C ～ 75°C
  • Operating Temp. (Wide)
  • -40°C ～ 85°C
  • Storage Temperature
  • -55℃ ～ 95℃
  • Vibration
  • 15G, 10~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Power Shield
  • ●
  • End-to-End Data Protection
  • ●
  • TRIM
  • ●
  • DEVSLP
  • ●
  • S.M.A.R.T.
  • ●
  • SP SMART Utility
  • ●
  • Warranty
  • 3 years and within TBW

Features

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.4
  • Support Data Security with AES 256 Encryption (Optional)
  • Support SP Toolbox SMART health monitoring software

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