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English
  • MDA3K0E<br><font ='#888888' size='2%'>3D TLC</font>
MDA3K0E
3D TLC

Specifications

  • Capacity
  • 64GB, 128GB, 256GB, 512GB, 1TB
  • Interface
  • SATA III/6.0Gbps
  • Flash Technology
  • 3D TLC
  • Seq. Performance Read (max.)
  • 540 MB/s
  • Seq. Performance Write (max.)
  • 520 MB/s
  • Random 4K Write (IOPS max.)
  • 85,000 (estimated)
  • Random 4K Read (IOPS max.)
  • 30,000 (estimated)
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Power Consumption (idle)
  • 540 mA
  • Dimension（mm）
  • 42.0 x 22.0 x 4.7
  • Operating Temp. (Standard)
  • -20°C ~ 75°C
  • Storage Temperature
  • -55℃ ～ 95℃
  • Vibration
  • 15G, 10~2000Hz
  • Drop
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Power Shield
  • Default Support
  • Power Consumption(max.)
  • 460 mA
  • TRIM
  • Default Support
  • S.M.A.R.T.
  • Default Support
  • SP SMART Utility
  • Default Support
  • Warranty
  • 3 years and within TBW

Features

  • NGFF M.2 (B+M Key) standard form factor
  • Compliant with Serial ATA Revision 3.1 standard with 6.0 Gb/s transfer rate
  • Support SP Toolbox SMART health monitoring software
  • Supports Data Security AES Encryption (optional)

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