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中文 (繁體)
  • SSU3F0S<br><font color='#888888' size='2%'> 3D TLC</font>
SSU3F0S
3D TLC

規格

  • 容量
  • 3.8TB, 7.6TB
  • 尺寸
  • 100.0 x 69.85.0 x 7 mm
  • 傳輸介面
  • PCIe Gen3x4, NVMe
  • Flash Technology
  • 3D TLC
  • External DRAM Buffer
  • ●
  • 循序讀取速度(最高)
  • 3,300 MB/s (estimated)
  • 循序寫入速度(最高)
  • 900 MB/s (estimated)
  • 4K隨機讀取速度 (IOPS)(最高)
  • 600,000 (estimated)
  • 4K隨機寫入速度 (IOPS)(最高)
  • 200,000 (estimated)
  • 平均故障間隔 (MTBF)(預估)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • 工作溫度(寬溫)
  • -40°C～85°C
  • 儲存溫度
  • -55°C ~ 95°C
  • 振動試驗
  • 15G, 10~2000Hz
  • 落摔試驗
  • 75cm
  • Shock
  • 1,500G@0.5ms
  • 電源防護
  • ●
  • 工作電壓
  • DC 12V
  • TRIM
  • ●
  • 端到端數據保護
  • ●
  • DEVSLP
  • ●
  • S.M.A.R.T.
  • ●
  • SP智慧工具
  • ●
  • 保固
  • 3 years and within TBW

特色

  • NGFF U.2 (SFF-8639) standard form factor
  • Compliant with NVMe Express 1.3
  • Supports Data Security with AES 256 Encryption
  • Supports SP Toolbox S.M.A.R.T. health monitoring software

訂購資訊

SSU3F0S
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
U.2 3D TLC PCIe 3.1 3840GB -40°C～85°C SP038TISSU3F1SW0
U.2 3D TLC PCIe 3.1 7680GB -40°C～85°C SP076TISSU3F1SW0
Show P/N by Capacity:
3840GB
Form Factor U.2
NAND 3D TLC
Interface PCIe 3.1
Capacity 3840GB
Temp. -40°C～85°C
P/N SP038TISSU3F1SW0

檔案下載

Factsheet
名稱 語言 檔案格式 版本 更新日期 檔案下載
SSU3F0S EN pdf. v2.0 2024/07
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