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中文 (简体)
  • MEM3M0E<br><font color='#888888' size='2%'> 3D TLC</font>
MEM3M0E
3D TLC

规格

  • 容量
  • 256GB, 512GB, 1TB
  • 尺寸
  • 30.0 x 22.0 x 3.5 mm
  • 接口
  • PCIe Gen4x4, NVMe
  • Flash Technology
  • 3D TLC
  • 连续读取速度(最大)
  • 4,500 MB/s
  • 连续写入速度(最大)
  • 2,400 MB/s
  • 随机4K读取 (IOPS)(最大)
  • 865,000
  • 随机4K写入 (IOPS)(最大)
  • 624,000
  • 平均故障間隔 (MTBF)(預估)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • PE cycle
  • 3000
  • 耗电流(待机)
  • 303 mA
  • 工作溫度(標準)
  • -20°C～75°C
  • 储存温度
  • -55°C～95°C
  • 储存湿度
  • 10% to 95% RH, non-condensing
  • 耐振动
  • 20G, 10~2000Hz
  • 跌落測試
  • 75cm
  • 耐冲击
  • 1,500G@0.5ms
  • 工作电压
  • DC 3.3V
  • 耗电流(最高)
  • 1300mA
  • Advanced Power Shield
  • ●
  • DEVSLP/ TRIM
  • ●
  • TCG Opal 2.0
  • ●
  • AES 256加密协议
  • ●
  • Thermal Throttling
  • ●
  • S.M.A.R.T.
  • ●
  • 写入保护
  • ●
  • Quick Erase
  • ●
  • SP智能监测
  • ●
  • 保固
  • 3 years and within TBW

特色

  • Compliant with PCI Express Base Specification Revision 4 standard with Gen4x4 8GB/s bandwidth.
  • Supports Data Security AES Encryption
  • Support TCG-OPAL 2.0
  • Optional hardware Write Protect Switch (Optional).

订购信息

MEM3M0E
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2230 3D TLC PCIe4.0 256GB -20°C～75°C SP256GIMEM3M5EV0
M.2 2230 3D TLC PCIe4.0 512GB -20°C～75°C SP512GIMEM3M5EV0
M.2 2230 3D TLC PCIe4.0 1TB -20°C～75°C SP010TIMEM3M5EV0
Show P/N by Capacity:
256GB
Form Factor M.2 2230
NAND 3D TLC
Interface PCIe4.0
Capacity 256GB
Temp. -20°C～75°C
P/N SP256GIMEM3M5EV0

档案下载

Factsheet
名稱 语言 档案格式 版本 更新日期 档案下载
MEM3M0E EN pdf. v1.0 2024/06
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