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中文 (简体)
  • MEM3K0E (E Key)<br><font color='#888888' size='2%'> 3D TLC</font>
MEM3K0E (E Key)
3D TLC

规格

  • 容量
  • 64GB～512GB
  • 尺寸
  • 30.0 x 22.0 x 3.5 mm
  • 接口
  • PCIe Gen3x1, NVMe
  • Flash Technology
  • 3D TLC
  • 外观尺寸
  • M.2 2230 (E key)
  • External DRAM Buffer
  • No
  • 连续读取速度(最大)
  • 890 MB/s
  • 连续写入速度(最大)
  • 880 MB/s
  • 随机4K写入 (IOPS)(最大)
  • 200,000
  • 随机4K读取 (IOPS)(最大)
  • 140,000
  • 平均故障間隔 (MTBF)(預估)
  • >3,000,000 hrs
  • PE cycle
  • 3,000
  • TBW (max.)
  • 512GB: 320 TB
    256GB: 160 TB
    128GB: 80 TB
    64GB: 40 TB
  • 工作温度
  • -40°C～85°C / -20°C～75°C
  • 储存温度
  • -55°C～95°C
  • 储存湿度
  • 10%～95%
    (30°C Max. Wet Bulb Temp)
  • 耐振动
  • 20G, 10～2000Hz
  • 跌落測試
  • 75cm
  • 耐冲击
  • 1,500G@0.5ms
  • 工作电压
  • DC 3.3V
  • 耗电流(最高)
  • 1420 mA
  • Power Idle / Standy
  • 130 mA
  • Advanced Power Shield
  • ●
  • 端到端数据保护
  • ●
  • AES 256加密协议
  • ●
  • Thermal Throttling
  • ●
  • DEVSLP
  • ●
  • S.M.A.R.T.
  • ●
  • 保固
  • 3 years within TBW

特色

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.3
  • Supports data security with AES-256 Encryption
  • Supports SP Toolbox S.M.A.R.T. health monitoring software

订购信息

MEM3K0E (E Key)
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2230 3D TLC PCIe 3.0 64GB -40°C～85°C SP064GIMEM3K5EWE
M.2 2230 3D TLC PCIe 3.0 64GB -20°C～75°C SP064GIMEM3K5EVE
M.2 2230 3D TLC PCIe 3.0 128GB -20°C～75°C SP128GIMEM3K5EVE
M.2 2230 3D TLC PCIe 3.0 128GB -40°C～85°C SP128GIMEM3K5EWE
M.2 2230 3D TLC PCIe 3.0 256GB -40°C～85°C SP256GIMEM3K5EWE
M.2 2230 3D TLC PCIe 3.0 256GB -20°C～75°C SP256GIMEM3K5EVE
M.2 2230 3D TLC PCIe 3.0 512GB -40°C～85°C SP512GIMEM3K5EWE
M.2 2230 3D TLC PCIe 3.0 512GB -20°C～75°C SP512GIMEM3K5EVE
Show P/N by Capacity:
64GB
Form Factor M.2 2230
NAND 3D TLC
Interface PCIe 3.0
Capacity 64GB
Temp. -40°C～85°C
P/N SP064GIMEM3K5EWE
64GB
Form Factor M.2 2230
NAND 3D TLC
Interface PCIe 3.0
Capacity 64GB
Temp. -20°C～75°C
P/N SP064GIMEM3K5EVE

档案下载

Factsheet
名稱 语言 档案格式 版本 更新日期 档案下载
MEM3K0E (E Key) EN pdf. v1.0 2024/12
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