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中文 (简体)
  • MEA3F0E<br><font ='#888888' size='2%'>3D TLC</font>
MEA3F0E
3D TLC

规格

  • 容量
  • 256GB, 512GB, 1TB, 2TB
  • 接口
  • PCIe Gen3x4, NVMe
  • Flash Technology
  • 3D TLC
  • 连续读取速度(最大)
  • 2,400 MB/s (estimated)
  • 连续写入速度(最大)
  • 2,100 MB/s (estimated)
  • 平均故障間隔 (MTBF)(預估)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • 随机4K读取 (IOPS)(最大)
  • 506,000 (estimated)
  • 随机4K写入 (IOPS)(最大)
  • 680,000 (estimated)
  • Power Consumption (idle)
  • 3420 mA (TBD)
  • Dimension（mm）
  • 42.0 x 22.0 x 3.6
  • 工作溫度(標準)
  • -20°C ~ 75°C
  • 储存温度
  • -55℃ ～ 95℃
  • 工作温度
  • -20°C ~ 75°C
  • 耐振动
  • 20G, 80~2000Hz
  • 跌落測試
  • 75cm
  • 耐冲击
  • 1,500G@0.5ms
  • 电源防护
  • ●
  • 工作电压
  • DC 3.3V
  • 耗电流(最高)
  • 3500 mA (TBD)
  • TRIM
  • ●
  • 端到端数据保护
  • ●
  • S.M.A.R.T.
  • ●
  • SP智能监测
  • ●
  • 保固
  • 3 years and within TBW

特色

  • NGFF M.2 (M Key) standard form factor
  • Compliant with NVMe Express 1.3
  • Support Data Security with AES 256 Encryption (Optional)
  • Support SP Toolbox SMART health monitoring software

订购信息

MEA3F0E
3D TLC

Form Factor NAND Interface Capacity Temp. P/N
M.2 2242 3D TLC PCIe3.0 256GB -20°C ～ 75°C SP256GIMEA3F5EV0
M.2 2242 3D TLC PCIe3.0 512GB -20°C ～ 75°C SP512GIMEA3F5EV0
M.2 2242 3D TLC PCIe3.0 1TB -20°C ～ 75°C SP010TIMEA3F5EV0
M.2 2242 3D TLC PCIe3.0 2TB -20°C ～ 75°C SP020TIMEA3F5EV0
Show P/N by Capacity:
256GB
Form Factor M.2 2242
NAND 3D TLC
Interface PCIe3.0
Capacity 256GB
Temp. -20°C ～ 75°C
P/N SP256GIMEA3F5EV0

档案下载

Factsheet
名稱 语言 档案格式 版本 更新日期 档案下载
MEA3F0E EN pdf. v4.0 2022/09
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