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Silicon Power

Produktregistrierung
Sharing
SHARING

Technische Daten

  • Kapazität
  • 256GB, 512GB
  • Schnittstelle
  • SD 7.0 / UHS-III
  • Flash Technology
  • 3D TLC
  • Seq. Performance Read (max.)
  • 800 MB/s
  • Seq. Performance Write (max.)
  • 700 MB/s
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Dimension（mm）
  • 15.0 x 11.0 x 1.0
  • Operating Temp. (Standard)
  • -25~+70C
  • Speichertemperatur
  • -40°C ～ 85°C
  • Vibration
  • 15G, 10 ～ 2000Hz
  • Fall
  • 150cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Stromverbrauch(max.)
  • 400 mA
  • Torque
  • 0.15Nm
  • Bending
  • 10N
  • Duration (cycles)
  • 10000
  • S.M.A.R.T.
  • ●
  • SP SMART Utility
  • ●
  • Gewährleistung
  • 3 years and within guaranteed TBW

Merkmale

  • Compliant to micro SD Memory Card Specification 7.0
  • Read/Write speed up to : 800/700 (MB/s)
  • Extended temperature available
  • Enhanced Data reliability with LDPC ECC Protection
  • SP SMART Toolbox
  • PE cycle: 3,000

Bestellinformation

SET320
3D TLC

256GB
  • SP256GISET322NE0

Herunterladen

Factsheet
NameName Language Ios Date  
CFX350 Factsheet English 2020/05
CFX550 Factsheet English 2020/05
SDT730 Factsheet English 2020/05
SDT530 Factsheet English 2020/05
SDT550 Factsheet English 2020/06
SDT350 Factsheet English 2020/06
SDI330 Factsheet English 2020/06
SDI530 Factsheet English 2020/06
SDI350 Factsheet English 2020/07
SDI550 Factsheet English 2020/07
SDI790 Factsheet English 2020/07
White Paper
NameName Language Ios Date  
SPOR resilient firmware for SP Industrial microSD card EN 2021/10
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