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Silicon Power

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Specificazioni

  • Capacità
  • 8GB ~ 16GB
  • Interfaccia
  • SD 3.0 / UHS-I
  • Flash Technology
  • MLC / 3D TLC
  • Seq. Performance Read (max.)
  • 81 MB/s
  • Seq. Performance Write (max.)
  • 46 MB/s
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Power Consumption (idle)
  • 90 uA
  • Dimension（mm）
  • 15.0 x 11.0 x 1.0
  • Operating Temp. (Standard)
  • -25°C ~85°C
  • Temperatura di conservazione
  • -40°C ～ 85°C
  • Operating Humidity
  • 10% ～ 95% (30°C Max. Wet Bulb Temp)
  • Vibrazione
  • 15G, 10 ～ 2000Hz
  • Caduta
  • 150cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Consumo d\' energia(max.)
  • 58 mA
  • Torque
  • 0.15Nm
  • Bending
  • 10N
  • Duration (cycles)
  • 10000
  • Garanzia
  • 3 years and within guaranteed TBW

Caratteristiche

  • Compliant with SD Memory Card Specification 3.0 and backwards-compatible with 2.0, 1.1, and 1.01
  • High endurance suitable for 24/7 continuous video recording
  • Steady performance design to ensure all frames are recorded
  • Supports SP Toolbox SMART Health Monitoring System software (optional)

Informazioni sugli ordini

SDT320
MLC / 3D TLC

8GB
  • SP008GISDT325NE0
16GB
  • SP016GISDT325NE0

Download

White Paper
NomeNome Language Ios Date  
SPOR resilient firmware for SP Industrial microSD card EN 2021/10
SPOR resilient firmware for SP Industrial microSD card EN 2021/10
Factsheet
NomeNome Language Ios Date  
CFX350 Factsheet English 2020/05
CFX550 Factsheet English 2020/05
SDT730 Factsheet English 2020/05
SDT530 Factsheet English 2020/05
SDT550 Factsheet English 2020/06
SDT350 Factsheet English 2020/06
SDI330 Factsheet English 2020/06
SDI530 Factsheet English 2020/06
SDI350 Factsheet English 2020/07
SDI550 Factsheet English 2020/07
SDI790 Factsheet English 2020/07
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