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Silicon Power

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Sharing
SHARING

Specifications

  • 용량
  • 1GB ~ 8GB
  • Interface
  • SD 3.0 / UHS-I
  • Seq. Performance Read (max.)
  • 32 MB/s
  • Seq. Performance Write (max.)
  • 28 MB/s
  • MTBF (est)
  • > 3,000,000 hrs
    *at 25 degrees Celsius , based on specification MIL-HDBK-217F part count method & Telcordia SR-332 Method
  • Power Consumption (idle)
  • 140 uA
  • Dimension（mm）
  • 15.0 x 11.0 x 1.0
  • Operating Temp. (Wide)
  • -25°C ~85°C
  • Storage Temperature
  • -40°C ～ 85°C
  • Accessories
  • 10% ～ 95% (30°C Max. Wet Bulb Temp)
  • Vibration
  • 15G, 10 ～ 2000Hz
  • Drop
  • 150cm
  • Shock
  • 1,500G@0.5ms
  • Power Requirement
  • DC 3.3V
  • Power Consumption(max.)
  • 70 mA
  • Torque
  • 0.15Nm
  • Bending
  • 10N
  • Duration (cycles)
  • 10000
  • S.M.A.R.T.
  • ●
  • SP SMART Utility
  • ●
  • 보증
  • 5 years and within guaranteed TBW

Features

  • Compliant with SD Memory Card Specification 3.0 and backwards-compatible with 2.0, 1.1, and 1.01
  • Suitable for Embedded system OS boot up and event log applications
  • Supports SP Toolbox SMART Health Monitoring System software
  • Supports SD and SPI modes

Order Information

SDT730
SLC

1GB
  • SP001GISDT731NW0
2GB
  • SP002GISDT731NW0
4GB
  • SP004GISDT731NW0
8GB
  • SP008GISDT731NW0

다운로드

Factsheet
NameName Language Ios Date  
SDT730 Factsheet English 2020/05
CFX350 Factsheet English 2020/05
CFX550 Factsheet English 2020/05
SDT730 Factsheet English 2020/05
SDT530 Factsheet English 2020/05
SDT550 Factsheet English 2020/06
SDT350 Factsheet English 2020/06
SDI330 Factsheet English 2020/06
SDI530 Factsheet English 2020/06
SDI350 Factsheet English 2020/07
SDI550 Factsheet English 2020/07
SDI790 Factsheet English 2020/07
White Paper
NameName Language Ios Date  
SPOR resilient firmware for SP Industrial microSD card EN 2021/10
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